搜搜做题作业网英语翻译Plating adhesion test :QUALITY OF PLATINGAdhesion Requir
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英语翻译
Plating adhesion test :
QUALITY OF PLATING
Adhesion Requirements:
Any or all of the following tests may be used to test adhesion to the base material.
1.Tape Test Method:
Scotch Brand #600,1-inch wide,tape shall be applied on the surface with uniform pressure.Within 90 ± 30 seconds of application,the tape shall be removed in a quick motion at 90 degrees to the surface.For acceptance,the finish shall remain unbroken after the tape is removed.
2.Bend Test:(ASTM B-571)
Evidence of poor adhesion,peeling or flaking of the coating from the substrate are causes for rejection.Cracking is acceptable in the bend area,unless the plating peels away from the substrate.
3.Scribe Test:
Scrape the surface of the plated articles to expose the base material.Examine the sample at four times magnification to determine if removal has been caused by the cutting away of an adherent plate or by the lifting of a non-adherent plate.
4.Burnishing Test:(ASTM B-571)
After the sample is rubbed for 15 seconds,the test area shall not have any blisters.Lifting or peeling of the plating is not acceptable.
5.Thermal Shock Test:(ASTM B-733)
Plating adhesion test :
QUALITY OF PLATING
Adhesion Requirements:
Any or all of the following tests may be used to test adhesion to the base material.
1.Tape Test Method:
Scotch Brand #600,1-inch wide,tape shall be applied on the surface with uniform pressure.Within 90 ± 30 seconds of application,the tape shall be removed in a quick motion at 90 degrees to the surface.For acceptance,the finish shall remain unbroken after the tape is removed.
2.Bend Test:(ASTM B-571)
Evidence of poor adhesion,peeling or flaking of the coating from the substrate are causes for rejection.Cracking is acceptable in the bend area,unless the plating peels away from the substrate.
3.Scribe Test:
Scrape the surface of the plated articles to expose the base material.Examine the sample at four times magnification to determine if removal has been caused by the cutting away of an adherent plate or by the lifting of a non-adherent plate.
4.Burnishing Test:(ASTM B-571)
After the sample is rubbed for 15 seconds,the test area shall not have any blisters.Lifting or peeling of the plating is not acceptable.
5.Thermal Shock Test:(ASTM B-733)
镀粘附试验：
电镀质量
粘附要求：
任何或所有以下测试可用于测试粘附的基础材料.
1 .胶带测试方法：
苏格兰威士忌品牌＃ 600 , 1英寸宽的磁带应适用于表面上均匀的压力.在90 ± 30秒的应用,磁带应被免职了快速运动在90度的表面.为接受,完成应保持完整的磁带后,被删除.
2 .弯曲试验： （乙美国ASTM - 571 ）
穷人的证据粘连,剥离或剥落的涂料从基材是引起排斥反应.催化裂化是可以接受的弯曲区,除非剥离镀远离基板上.
3 .雕测试：
划痕的表面镀金的文章,揭露的基础材料.检查样品的4倍放大,以确定是否已消除所造成的切割以外的贴板或取消对非贴板.
4 .抛光试验： （乙美国ASTM - 571 ）
后样品的摩擦15秒,试验区,不得有任何水泡.取消或剥离的电镀是不能接受的.
5 .热冲击试验： （乙美国ASTM - 733 ）
电镀质量
粘附要求：
任何或所有以下测试可用于测试粘附的基础材料.
1 .胶带测试方法：
苏格兰威士忌品牌＃ 600 , 1英寸宽的磁带应适用于表面上均匀的压力.在90 ± 30秒的应用,磁带应被免职了快速运动在90度的表面.为接受,完成应保持完整的磁带后,被删除.
2 .弯曲试验： （乙美国ASTM - 571 ）
穷人的证据粘连,剥离或剥落的涂料从基材是引起排斥反应.催化裂化是可以接受的弯曲区,除非剥离镀远离基板上.
3 .雕测试：
划痕的表面镀金的文章,揭露的基础材料.检查样品的4倍放大,以确定是否已消除所造成的切割以外的贴板或取消对非贴板.
4 .抛光试验： （乙美国ASTM - 571 ）
后样品的摩擦15秒,试验区,不得有任何水泡.取消或剥离的电镀是不能接受的.
5 .热冲击试验： （乙美国ASTM - 733 ）
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